Chiplet-based systems-on-chip (SoCs) are modern, modular processors composed of interconnected functional building blocks like central processing units, hardware accelerator units and memory on smaller, separate silicon dies (chiplets). This enables manufacturers to mix and match technologies, scale manufacturing quickly and easily, and significantly reduce costs compared to traditional monolithic (single-die) chips. The EU-funded CHASSIS project aims to establish a collaborative ecosystem for chiplet-based SoCs for high-performance computing automotive applications to power the next generation of electrified, connected and autonomous vehicles. CHASSIS will cover the value chain of chiplet-based SoCs, bringing together partners from research and industry and ensuring multi-vendor compatibility. The collaboration will also strengthen Europe’s semiconductor sector and its independence.
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IMEC Germany GmbH, Germany
Bayerische Motoren Werke Aktiengesellschaft, Germany
Infineon Technologies, Germany
Siemens Industry Software a Limitedliability Company under the Privatefree Zones Regime, Egypt
Menta SAS, France
Infineon Technologies Austria AG, Austria
Axelera AI BV, Netherlands
Centro Ricerche Fiat SCPA, Italy
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